Products


SCORPION Ⅲ

  • Powered by Nexell NXP3220, Cortex-A7 Dual-Core Processor
  • Highest memory bandwidth
  • Full-HD Multimedia video decoder
  • High-speed interfaces


ExSOM-3220


SCORPION Ⅲ DVK Specification

Features Description
CPU NXP3220 Cortex-A7 Dual-Core CPU@Max1.0GHz
Memory DDR3L x 4Gb(256Mx16) built-on SOM
Storage 8GB eMMC, MicroSD card(SD 3.0) slot
Display LVDS Output LVDS PHY(4-lane data, 1-lane clock)
Network 1000M Ethernet, WiFi(Dual 802.11ac) /BT(4.2) Module
Camera CCIR 656/601
USB USB2.0 Host 3 ports, USB2.0 Device ports(Framework image download)
Audio Headphone Jack, Speaker(AMP)
General IO GPIO, I2C, SPI, UART,CAN, RS485 and more…
Power 5V 2A (5V 3A with LCD)
Temperature Range Commercial / Industrial (Option)
Mechanical Size CPU Board 69.6mm x 36mm x 1.2T
Base Board 115mm x 105mm x 1.6T
WiFi/BT Combo module 28mm x 37mm x 1.2T
Software Yocto BSP (U-boot, Linux kernel 4.14)
QT Displayaudio SDK5.6.3

SCORPION Ⅲ CPU Specification

  • CPU
    • 28 nm, HKMG (High-K Metal Gate) Process Technology
    • Cortex-A7 Dual-Core CPU @ max1.0 GHz
  • System Controller
    • 5 x 32-ch DMAs (2 x DMA, 2 x Secure-DMA, 1 x MDMA)
    • various Power Mode (Normal, Idle, Standby, Deep-standby)
    • various boot modes including SPI Flash/EEPROM, Nand-Flash, SD (eMMC), USB and UART
  • Memory/Storage Controller
    • 16bit DDR3, DDR4 up to 1250 MHz
    • various memory
    • MLC/SLC NAND Flash with Hardwired ECC algorithm (4/8/12/16/24/40/60-bit)
    • 3-ch SD/MMC
  • FHD Multi-format video codec
    • Full-HD Multi Format Video Decoder
  • Display Controller & Video Post-processor
    • Display up to 1920X1080
    • 1-ch LVDS Interface
  • Video Input Processor
    • 1-ch ITUR.BT 656/601 Parallel Video Interface
  • Connectivity
    • 2-ch Controller Area Network V3.2.1.2
    • 10/100M-bit Ethernet MAC (RMII I/F)
    • 10/100/1000M-bit Ethernet MAC (RGMII I/F)- 3-ch SD/MMC
    • 2-ch USB 2.0 Host, 1-ch USB 2.0 OTG
  • Peripherals
    • 7-ch UARTs, 4-ch Timer, Interrupt Controller, RTC
    • 4-ch I2S, 5-ch I2C, 3-ch SPI, 4-ch PWM, and GPIOs
    • 8-ch 12-bit ADC (with supports resistive touch panel)
    • SPDIF, Supports 4-ch RS485
    • 4-ch PDM data
  • Security
    • Security functions (AES, DES/TDES, SHA-1, MD5, PRNG and TRNG) and Secure JTAG
    • ARM Trust Zone technology
  • Package
    • 380 Ball FCBGA Package, 0.80 mm Ball Pitch, 17X17 mm Body size


SCORPION Ⅲ CPU Board Description

scp3_cpuboard_blk.png


SCORPION Ⅲ DVK Description

scp3_dvk_dsc.png

scp3_dvk_dsc.png

SCORPION_3_dvk_block

Display

  • 10.1 inch Capacitive Touch
    • 1280 x 800 Resolution
    • Mechanical Size 228.6mm x 149.2mm
  • Ordering Information

    The product consists of following items:

    • SCORPION Ⅲ Board
    • LCD Option

    Offering materials

    • H/W specification (CPU Board map, PCIe pin map)
    • Base Board schematic, Mechanical specification, Connector & AP specification
    • S/W (Source, How to compile)
    • QT Displayaudio SDK.6.3(Vmware image)

    Please contact howchip@howchip.com to inquire for purchase and further information.



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    Copyright © 2011: UNIBEST INC. The Howchip.com is owend by Unibest Inc.


    고객센터

    Email : howchip@howchip.com

    Tel : 031-8017-0905, Fax: 031-8017-0906

    유니베스트(주)

    (16827)경기도 용인시 수지구 신수로 767, A동 1403호 (동천동 분당수지U-Tower)

    대표이사 : 배수태, 통신판매업신고 : 2012-경기성남-0822호